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      Shin-Etsu die attach materials come in two types : epoxy and silicone type. Epoxy based B stage material is a high purity insulating die attach material developed for stencil or screen printing. It has excellent releasability, shape retention, storage stability at B stage status(semi-cured status with no tack appearance). After chip bonding, it can be re-melted by heating at high temperature and treated like thermal curing. It shows very low stress after curing.

      Applications

      • Semiconductor device
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      For Inquiries About This Product
      • Company:
        Shin-Etsu Chemical Co., Ltd.
      • Department:
        Electronics Materials Division, Organic Electronics Materials Dept.
      • Phone:
        +81-3-3246-5231
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